| 摘要 |
PROBLEM TO BE SOLVED: To achieve superior planarization of semiconductor wafers having various surface profiles. SOLUTION: This CMP(chemical-mechanical polishing) apparatus has a wafer carrier (303) for carrying a wafer (301) whose polished surface is exposed and a polishing roller (304), which is cylindrical, has a polishing pad stuck to its surface and composed of a plurality of portions having different polishing characteristics, and is brought into line contact with the polished surface. The polishing roller carries out polishing, while it undergoes two rotating motions with the center axis of the cylinder and an axis perpendicular to the polished surface, which divides the longitudinal length of the cylinder into two and is perpendicular to the center axis as two rotation axes of the two rotating motions; and at the same time, undergoes translation motion. A polishing pressure applied to the polished surface by the roller, the two rotating motions, and the translation are controlled by a built-in controller. |
