| 摘要 |
PROBLEM TO BE SOLVED: To further reduce possibility for an IC module to be destroyed or for the IC module and an antenna to be disconnected at a contact when external force is applied to a non-contact IC card in a folding direction or external force is applied to the IC module while being concentrated. SOLUTION: An IC module 11 packaged on a resin sheet 15 is covered with a resin 16 for sealing and further, a reinforcing member 13 which is formed in the shape of flange such that a portion to be in contact with the resin sheet 15 is in plane-contact to the resin sheet 15, a while being U-shaped for covering the resin 16 for sealing, is packaged on the resin sheet 15. |
