发明名称 SOLID-STATE IMAGE PICKUP DEVICE
摘要 PROBLEM TO BE SOLVED: To reduce the size and cost of a sensor row section by constituting the section of photosensors, having short lengths in the subscanning direction. SOLUTION: On the upper surface of an element chip 100, provided with the sensor row section 110, a CCD transfer register 120, a readout gate section 130, etc., a semicylindrical lens 140 having lens functions, a shading correcting (suppressing) function, and a specific wavelength transmitting function is provided. The lens 140 has a semiconductor cross section in the subscanning direction, and in order to obtain the shading correcting function for correcting the shading caused by optical conditions on the outside of the solid-state image pickup device, the lens 40 also has a surface curved in the main scanning direction. In addition, the lens 140 has large diameters at both ends and a small diameter at the central part. The partial or the overall body of the lens 140 is formed of a material that transmits signals having a specific wavelength.
申请公布号 JP2003060183(A) 申请公布日期 2003.02.28
申请号 JP20010248063 申请日期 2001.08.17
申请人 SONY CORP 发明人 TANAKA KIYOHISA
分类号 H01L27/14;G06K7/10;G06T1/00;H01L27/148;H04N1/028;H04N5/225 主分类号 H01L27/14
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