| 摘要 |
PROBLEM TO BE SOLVED: To reduce the thickness of semiconductor devices, by grinding a resin- sealed block and to equally grind the resin-sealed block by removing bending of it. SOLUTION: The semiconductor devices 10 are manufactured through a process (B) for facedown mounting a plurality of semiconductor chips 11 onto the surface of a board 12, a process (C) for feeding mold resin 13 onto the board 12 to mold the resin-sealed block 18 for sealing the plurality of semiconductor chips 11, a process (E) for half-cutting the resin-sealed block 18 from the side of the board 12, and a process (F) for grinding the resin-sealed block 18 from the side of the mold resin 13 for separating the individual semiconductor devices 10. |
