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发明名称
Halbleiterchipgehäuse mit Kühlvorrichtung
摘要
Die Erfindung bezieht sich auf ein Halbleiterchipgehäuse (1) mit Kühlvorrichtung, die insbesondere die Wärme schnell vom Halbleiterchip (11) wegführen kann, Störungen filtern kann und die Induktivität während des Betriebs reduzieren kann.
申请公布号
DE10157299(A1)
申请公布日期
2003.02.27
申请号
DE2001157299
申请日期
2001.11.22
申请人
ORIENT SEMICONDUCTOR ELECTRONICS LTD., KAOHSIUNG
发明人
SHIEH, WEN LO;HUANG, NING;CHEN, HUI PIN;CHIANG, HUA WEN;CHANG, CHUNG MING;TU, FENG CHANG;HUANG, FU YU;CHANG, HSUAN JUI;HU, CHIA CHIEH;LEU, WEN-LONG
分类号
H05K7/20;H01L23/055;H01L23/40
主分类号
H05K7/20
代理机构
代理人
主权项
地址
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