发明名称 A SPUTTER TARGET
摘要 <p>The invention relates to a sputter target and more particularly to a zinc sputter target.The target comprises a target holder having an outer surface and a target material formed on said outer surface. The target material has a relative density higher than 92 % of the theoretical density of the metal or metal alloy.Furthermore the invention relates to a process for the manufacturing of a sputter target.</p>
申请公布号 WO2003016583(A1) 申请公布日期 2003.02.27
申请号 EP2002007694 申请日期 2002.07.10
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