发明名称 Epoxy/clay nanocomposite for making printed circuit boards
摘要 An epoxy/clay nanocomposite suitable for use as matrix material for printed circuit boards is disclosed. The nanocomposite of the present invention comprises a layered clay material uniformly dispersed in an epoxy polymer matrix, wherein the clay material has been modified to an organoclay by ion exchange with (1) benzalkonium chloride and (2) dicyandiamide or tetraethylenepentamine. The epoxy/clay nanocomposites of the present invention have superior dimensional and thermal stability, and a lower hygroscopic property. The invention also includes the prepregs or circuit boards containing the epoxy/clay nanocomposite.
申请公布号 US2003039812(A1) 申请公布日期 2003.02.27
申请号 US20010987165 申请日期 2001.11.13
申请人 INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, NAN YA PLASTICS CORPORATION 发明人 TSAI TSUNG-YEN;JONG SUNG-JENG;YEH AN-CHI;CHIANG JOSHUA;FANG BOR-REN
分类号 C08J5/24;C08K9/04;H05K1/03;(IPC1-7):B32B3/00 主分类号 C08J5/24
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