Electronic component comprises a semiconductor element mounted in a plastic housing, and electrical connections arranged between contact surfaces on an active surface of the element and contact connecting surfaces of conductor connections

摘要

Electronic component comprises a semiconductor element (4) mounted in a plastic housing (8) having horizontally running flat conductor connections (10); and electrical connections arranged between the contact surfaces (43) on one active surface (41) of the element and contact connecting surfaces (105) of the conductor connections using bonding wires (12). The conductor connections are each structured and are vertically and/or horizontally flexible. An Independent claim is also included for a process for the production of the electronic component. Preferably the conductor connections each have a recess (101). The semiconductor element is mounted with its passive rear side (42) on a support substrate (6).