DICING ADHESIVE SHEET AND DICING METHOD

摘要

A dicing adhesive sheet having a base film and an adhesive layer formed on the base film is characterized in that the thickness of the adhesive layer ranges from 1 to 10µm and the adhesive layer has an application temperature such that the adhesion measured when 180°C peeling at 23°C of the dicing sheet is conducted(the peeling speed is 300 mm/min)after it is applied to a silicon mirror wafer is 10 N/25 mm or more.In a dicing method using such a dicing adhesive sheet,the production yield of a diced body such as a semiconductor wafer is high,and chipping during the dicing is prevented.