| 发明名称 |
MULTIPLE LED CHIP PACKAGE |
| 摘要 |
A surface-mount package for multiple LED chips is constructed by inscribing a groove in an insulating substrate. The LED chips are mounted in the groove and the leads are connected to metal plates, which wrap around the substrate to provide bottom contacts for surface-mounting.
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| 申请公布号 |
US2003038292(A1) |
申请公布日期 |
2003.02.27 |
| 申请号 |
US20010940152 |
申请日期 |
2001.08.27 |
| 申请人 |
WANG BILLY;CHANG BILL;LEE YANN |
发明人 |
WANG BILLY;CHANG BILL;LEE YANN |
| 分类号 |
H01L33/48;H05K3/34;(IPC1-7):H01L27/15 |
主分类号 |
H01L33/48 |
| 代理机构 |
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代理人 |
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