发明名称 |
Substrate-on-chip packaging process |
摘要 |
A SOC (Substrate-On-Chip) packaging process is disclosed. A layer of two-stage thermosetting mixture with solvent is coating on an upside of a substrate. Thereafter, the substrate is heated for removing solvent so that the two-stage thermosetting mixture becomes a B-stage dry adhesive film without solvent. Thus, the bonding pads of the chip are not covered by the dry adhesive film and a better operating flexibility is obtained in the SOC packaging process.
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申请公布号 |
US2003040142(A1) |
申请公布日期 |
2003.02.27 |
申请号 |
US20020227341 |
申请日期 |
2002.08.26 |
申请人 |
LIN CHUNG-HUNG;CHUNG C.L.;HUANG JESSE;LEE Y.J. |
发明人 |
LIN CHUNG-HUNG;CHUNG C.L.;HUANG JESSE;LEE Y.J. |
分类号 |
H01L23/31;H01L23/495;(IPC1-7):H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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