| 摘要 |
An electrical component (10) is disclosed, comprising at least one baseplate (12), upon which electrical components (11) are arranged and/or integrated therein. Further, a cooling device (20) is provided, for cooling the electrical component (10). According to the invention, an effective cooling of the electrical component (10) with concomitant low space requirement for the cooling device (20) may be achieved, whereby the cooling device (20) is embodied as a heat exchanger, arranged within the baseplate (12). The heat exchanger may for example comprise a channel system with one or several cooling channels (21), preferably embodied as micro-channels. A cooling medium flows through said cooling channels (21). |
