Semiconductor device and apparatus for manufacturing same

摘要

A semiconductor manufacturing apparatus is provided with a cavity-depth adjusting mechanism for moving a movable member relative to a stationary member to adjust the depth of cavities according to the thickness of a package to be molded. The semiconductor manufacturing apparatus is further provided with a material-thickness adjusting mechanism for moving another movable member relative to another stationary member to adjust the level of a lead frame mounting surface according to the thickness of a lead frame to be mounted.