SEMICONDUCTOR PACKAGE WITH STACKED FLIP CHIP AND WIRE BONDED UPPER DIE

摘要

A circuit assembly is formed with a lower flip-chip die, a wire bonded upper die stacked on the lower die and a non-conductive adhesive therebetween. The combination of a lower flip-chip die and upper wire bonded die enables efficient electrical connection of both dies with a similar size to a chip carrying substrate thereby enhancing flexibility and circuit density.