| 摘要 |
<p>An integrated interface structure for a nested body (104) to provide an electrical connection. The interface structure includes nested bond pads (112, 114) which electrically interface with leads (116-1, 116-2). The nested bond pads are fabricated on a microstructure to provide an interface to drive circuitry (106) for transducer elements of a slider or head (160) supported by the microstructure.</p> |
