| 摘要 |
A semiconductor package without outer leads such as QFN, SON is disclosed. The semiconductor package includes a die, a molding compound sealing the die, a plurality of metal leads, a plurality of metal bonding wires electrically connecting the die with the metal leads, and a plurality of metal support boards surrounded by the metal leads. The metal support boards support the die together by adhering and are used for being the power connecting terminals or ground potentials. Thus, the semiconductor package has a smaller thermal stress between the die and the metal support boards to avoid a warpage of the package or a delamination and a less noise interference.
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