RESIN COMPOSITION, MOLDED OBJECT THEREOF, AND USE THEREOF

摘要

A resin composition which comprises (A) at least one heat-resistant thermoplastic resin selected among polyketone resins, polyimide resins, polyethernitriles, polybenzimidazole, polyphenylene sulfide, polysulfones, polyethersulfones, polyarylates, liquid-crystal polyester resins, and 1,4- polyphenylene and (B) a flaky inorganic filler which (1) has a Mohs' hardnes s of 3.0 or lower, (2) has a coefficient of linear expansion of 5.0x10-5 /K or lower, (3) retains chemical inertness and a layer structure at temperatures not higher than at least 500~C, and (4) has an aspect ratio (ratio of the average particle diameter to the thickness) of 10 or higher; a molded object of the resin composition; and as a use thereof a base film for printed circu it boards.