Pressure sensor, e.g. for tires, has first synthetic material covering connecting elements, inner sections and contact surfaces, more deformable synthetic material covering pressure-sensitive region

摘要

The device has a semiconducting chip with contact surfaces on a pressure-sensitive region exposed to external pressure, a housing with a floor on which the chip is arranged and a wall enclosing the chip through which flat conductors pass. Elements connecting the contact surfaces with the inner conductor sections, inner sections and contact surfaces are covered by one synthetic material, the pressure-sensitive region by a more deformable material. The device has a semiconducting chip (2) with a pressure-sensitive region (4) subjected to external pressure and contact surfaces (6) on the pressure-sensitive region, a hollow housing (8) with a floor (9) on which the chip is arranged, a housing wall (10) enclosing the chip through which flat conductors (30) pass and elements connecting the contact surfaces with the inner sections of the flat conductors. The connecting elements (14), inner sections and contact surfaces are covered with a first synthetic material (15). The pressure-sensitive region is at least partly covered with a more deformable second synthetic material (16). Independent claims are also included for the following: (a) a vehicle tire with an inventive pressure sensor (b) and a motor vehicle with an inventive pressure sensor.