发明名称 Laminate film for mounting electronic devices and film carrier tape for mounting electronic devices
摘要 A laminate film for mounting electronic devices includes a conductive layer and an insulating film which are bonded through thermocompression bonding. The coefficient of thermal expansion of the insulating film along the width direction thereof is substantially equal to or higher than that of the conductive layer along the width direction thereof.
申请公布号 US2003038379(A1) 申请公布日期 2003.02.27
申请号 US20020219487 申请日期 2002.08.16
申请人 MITSUI MINING & SMELTING CO., LTD. 发明人 KAWASAKI SHUICHI;TERADA HIROMU
分类号 H01L21/60;H01L23/498;H05K1/00;H05K1/03;H05K3/38;(IPC1-7):H01L23/495;H01L23/48 主分类号 H01L21/60
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