发明名称 |
Laminate film for mounting electronic devices and film carrier tape for mounting electronic devices |
摘要 |
A laminate film for mounting electronic devices includes a conductive layer and an insulating film which are bonded through thermocompression bonding. The coefficient of thermal expansion of the insulating film along the width direction thereof is substantially equal to or higher than that of the conductive layer along the width direction thereof.
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申请公布号 |
US2003038379(A1) |
申请公布日期 |
2003.02.27 |
申请号 |
US20020219487 |
申请日期 |
2002.08.16 |
申请人 |
MITSUI MINING & SMELTING CO., LTD. |
发明人 |
KAWASAKI SHUICHI;TERADA HIROMU |
分类号 |
H01L21/60;H01L23/498;H05K1/00;H05K1/03;H05K3/38;(IPC1-7):H01L23/495;H01L23/48 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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