Method and apparatus for removal of unwanted electroplating deposits,申请号US20020269250-传众专利搜索

发明名称	Method and apparatus for removal of unwanted electroplating deposits
摘要	An apparatus and associated method for removing deposits from a substrate. In one aspect, a system is provided which supplies etchant to an edge bead removal chamber. The apparatus includes an etchant delivery system, an etchant tank, a sensor, and a mixing tank.
申请公布号	US2003038107(A1)	申请公布日期	2003.02.27
申请号	US20020269250	申请日期	2002.10.11
申请人	APPLIED MATERIALS, INC.	发明人	NAYAK RADHA;DORDI YEZDI;STEVENS JOSEPH;HEY PETER
分类号	C25D5/48;C23F1/08;C23F1/16;H01L21/288;H01L21/306;H01L21/308;H01L21/3213;(IPC1-7):C23F1/00;B08B3/00;C03C15/00;B44C1/22	主分类号	C25D5/48
代理机构		代理人
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