发明名称 |
Method of manufacturing a metal-ceramic circuit board |
摘要 |
A metal-ceramic circuit board is characterized by being constituted by bonding on a base plate of aluminum or aluminum alloy at least one of ceramic substrate boards having a conductive metal member for an electronic circuit. A method of manufacturing a metal-ceramic circuit board is characterized by comprising the steps of melting aluminum or aluminum alloy in a vacuum or inert gas atmosphere to form a molten metal, contacting one surface of a ceramic substrate board directly with the molten metal in a vacuum or inert gas atmosphere, cooling the molten metal and the ceramic substrate board to form a base plate of aluminum or aluminum alloy, which is bonded directly on the ceramic substrate board without forming any oxidizing film therebetween and bonding a conductive metal member for an electronic circuit on the ceramic substrate board by using a brazing material. The base plate has a proof stress not higher than 320 (MPa) and a thickness not smaller than 1 mm.
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申请公布号 |
US2003037434(A1) |
申请公布日期 |
2003.02.27 |
申请号 |
US20020242022 |
申请日期 |
2002.09.12 |
申请人 |
DOWA MINING CO., LTD. |
发明人 |
OSANAI HIDEYO;FURO MASAHIRO |
分类号 |
C04B37/00;H01B13/00;H01L23/14;H01L23/373;H01L25/07;H01L25/18;H05K1/03;H05K1/05;H05K3/00;H05K3/38;H05K7/20;(IPC1-7):H05K3/20;H05K3/34;H05K3/10 |
主分类号 |
C04B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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