| 摘要 |
A module housing apparatus protects modules having sensitive electrical, optical, and/or electro-optical components from physical and electrostatic discharge (ESD). The module housing apparatus includes a box constructed or coated with a conductive material and having an open end. Module board guides are formed in opposing inside surfaces of the conductive box and include slots that accept and guide the board edges of the module. The conductive module faceplate mates with the conductive box to form a Faraday cage that protects the components of the module from ESD. The module board guide may be modified to accept the module faceplate inner profile including, for example, a recess that accepts a module holding clip and/or an insertion guide to guide the board edges into the slot. A retaining mechanism such as a strap may be used to hold the module in the housing. |
