| 摘要 |
The invention relates to a method and a device for modifying the position of electronic components (2), for example a chip. The component (2), provided on a film, in matrix-type containers, or in or on a tool at a picking position, is picked up, held and transported by a picking device (1) and is placed in a delivery position, for example in an intermediate position or a processing position. It can also be held in an additional picking position for a further positional modification. At least two components in at least one picking position (2) are picked up simultaneously and/or are placed simultaneously in at least one delivery position. If the components (2) are placed in an intermediate position, said intermediate position functions as both a delivery and a picking position. The arrangement of the components (2) relative to one another is modified between the picking position and the delivery position.
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