发明名称 |
WORKPIECE DISTRIBUTION AND PROCESSING IN A HIGH THROUGHPUT STACKED FRAME |
摘要 |
An integrated workpiece vacuum processing system for processing semiconductor workpieces is provided using a stacked chamber design. The processing system comprises a multiple chamber support unit having a plurality of processing chamber support bays arranged in rows and columns wherein a vacuum processing chamber module is received in each support bay and a transfer chamber is coupled to the plurality of processing chamber modules. |
申请公布号 |
WO02073665(A3) |
申请公布日期 |
2003.02.27 |
申请号 |
WO2002US07228 |
申请日期 |
2002.03.11 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
DONALDSON, GARY, R.;WANG, WILLIAM |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|