发明名称 |
METHOD FOR MANUFACTURING THIN FILM TRANSISTOR SUBSTRATE |
摘要 |
PURPOSE: A method for manufacturing a thin film transistor substrate is provided to improve the electric characteristics of thin film transistors by removing protrusions of a polycrystalline silicon layer. CONSTITUTION: A method for manufacturing a thin film transistor substrate includes the steps of vapor depositing an amorphous silicon layer on a substrate(10); forming a polycrystalline silicon layer(20S) by crystallizing the amorphous silicon layer through laser annealing; planarizing the surface of the polycrystalline silicon layer by processing with cathode water; forming a semiconductor pattern by patterning the polycrystalline silicon layer; forming a gate insulating film covering the semiconductor pattern; forming gate electrodes overlapping with the part of the semiconductor pattern on the gate insulating film; forming source and drain areas on the semiconductor pattern by pouring impurities into the semiconductor pattern; forming an interlayer insulating film covering the gate electrodes and the semiconductor pattern; and forming pixel electrodes electrically connected to the source areas on the interlayer insulating film.
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申请公布号 |
KR20030016052(A) |
申请公布日期 |
2003.02.26 |
申请号 |
KR20010049964 |
申请日期 |
2001.08.20 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JUNG, JIN GU |
分类号 |
G02F1/136;(IPC1-7):G02F1/136 |
主分类号 |
G02F1/136 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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