| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a laser beam machining method for obtaining a desirable worked shape and a manufacturing method for printed wiring board adopting the same. SOLUTION: This laser beam method comprises a laser beam machining process which forms a through-hole and a via-hole of which the area of opening part is larger than the area of spot of pulse laser by performing pulse laser shots to a work substrate. In the laser beam machining process, a plurality of times of the shots are performed while shifting the irradiation position in such a manner that a first irradiation region F1 which is irradiated with the pulse laser and a second irradiation region F2 which is irradiated succeeding to the first irradiation region F1 in the machined surface of the work substrate are overlapped with each other. Therein, when an area of the region in which the first irradiation region F1 and the second irradiation region F2 are overlapped with each other is B and an area of the spot of the pulse laser is A, the control is performed in such a manner that B/A is >=0.25 and <=0.80.</p> |
