| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for a laser beam machining with which the machining is performed while generated swarf is effectively removed, a method for manufacturing a printed wiring board and a device for manufacturing the printed wiring board, in which method and device the method for the laser beam machining is adopted, by which method and device the generation of a defect originated from the swarf is suppressed. SOLUTION: The method for manufacturing the printed wiring board includes a laser beam machining process in which a work substrate W is irradiated with a laser beam to form a via hole or a through hole. In the laser beam machining process, the laser beam machining is performed while ions generated with an ion generating device 47 provided on a laser machining device 100 (printed wiring board manufacturing device) are supplied together with an auxiliary wind to the work substrate W and the swarf generated from the substrate during the machining is deelectrified. The sucking force of a dust collecting device 46 is superimposed to the pressure of the auxiliary wind, thus the swarf of the substrate is effectively removed from the top of the work substrate W.</p> |
