发明名称 LASER MACHINING DEVICE AND METHOD FOR CONTROLLING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a laser machining device and a method for controlling the device by which the maximum scanning region of a galvanoscanner suitable for machining of a work is selected and a machining tact is controlled to be made short. SOLUTION: The device is composed of an input part 1 for inputting machining information for the work, a machining condition information storing part 2 which stores the machining condition information of the inputted machining information, a machining position information storing part 3 which stores the position information of the inputted machining information, a real machining position information making part 5 which makes positioning information of the galvanoscanner 7 and an X-Y table 8 from the stored position information, a real machining position information storing part 4 which stores the positioning information, a controlling part 6 which controls the galvanoscanner, the X-Y table, and a laser oscillator 9, the galvanoscanner, the X-Y table and the laser oscillator, and the maximum region of the scanning region of the galvanoscanner is selected based on the machining information of the work with the real machining information making part and the real machining positioning information of the galvanoscanner and the X-Y table is made from the position information.
申请公布号 JP2003053562(A) 申请公布日期 2003.02.26
申请号 JP20010242880 申请日期 2001.08.09
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NISHIGAKI HIROBUMI;KATAIDE AKIRA
分类号 B23K26/00;B23K26/08;(IPC1-7):B23K26/00 主分类号 B23K26/00
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