| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for efficiently manufacturing an aromatic polyimide film improved both in adhesion properties to a metal and in dimensional stability of a metallic article to which it is bonded. SOLUTION: An aromatic polyimide film is subjected to a heat-treatment in advance at a temperature of 200-500 deg.C and subsequently to a discharge treatment on one surface or both surfaces thereof to give an aromatic polyimide film having a heat shrinkage stress of 10 MPa or less and a surface free energy of 75-150 mN/m. |
