| 摘要 |
PROBLEM TO BE SOLVED: To provide copper alloy foil for a laminate sheet with a small surface roughness which has satisfactory wettability with varnish, and is directly joined with polyimide even without undergoing roughening treatment in a two layer printed circuit board having a resin substrate in which varnish containing polyamic acid is used as the raw material. SOLUTION: In a copper alloy containing specified elements, by controlling the thickness of a rust preventive film to <=5 nm, the copper alloy foil for a laminate sheet having satisfactory wettability with varnish, and having excellent strength and electric conductivity, and having >=8.0 N/cm 180 deg. peel strength with a film obtained by thermally hardening polyamic acid, without undergoing roughening treatment, is provided.
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