SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURED THEREBY

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus equipped with an efficient resin sealing mold assembly capable of using a mold in common even if the thickness of the mold or the thickness of a lead frame is different. SOLUTION: A movable member is moved to a fixed member corresponding to the mold thickness of a package by a cavity depth adjusting mechanism 8 to regulate the depth of a cavity. The movable member 12 is moved to the fixed member 10 corresponding to the thickness of the lead frame to be loaded by a substrate thickness adjusting mechanism 6 to regulate the position of the loading surface of the lead frame.