RESIN SEALING METHOD FOR SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a resin sealing method for a semiconductor device capable of perfectly preventing the creeping-in of a resin in resin sealing. SOLUTION: A film 6 and a lead frame 1 are successively stacked on the upper surface of a lower clamp block 5a and clamped by the lower clamp block 5a and an upper clamp block 5b having a recessed part not interfering with a semiconductor chip, a wire or the like provided to the undersurface thereof. Air is injected in the recessed part 5c of the upper clamp block 5a and pressurized to bring the lead frame and the film 6 to a close contact state.