| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for semiconductor sealing suitable for sealing of thin type semiconductor devices such as LQFP and TSOP and excellent in resistance to soldering, high-temperature storage property and reliability for moisture resistance. SOLUTION: This epoxy resin composition for semiconductor sealing consists essentially of (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler and (E) a chelate functional group-containing additive, and contains the component E in an amount of 0.03-0.5 wt.%.
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