| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrolytic copper plating method. SOLUTION: In the electrolytic copper plating method, a base body is subjected to the electrolytic copper plating, and a copper electrolyte used for the electrolytic copper plating is subjected to a dummy plating by using an insoluble anode. The copper electrolyte plating liquid can be maintained and recovered by the method so as to realize excellent plating appearance of the precipitated copper, high denseness of a film of the precipitated copper, and good via filling property.
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