| 摘要 |
PROBLEM TO BE SOLVED: To provide a welding method and a device thereof which suppresses oxidation, etc., of solder and, at the same time, performs a welding operation in a short time by quickly elevating die temperature up to a prescribed temperature when a semiconductor chip is welded to the die by fusing the solder. SOLUTION: This welding device is provided with a heater 6 which heats the die 20 up to fusing temperature of the solder 21 and a cooling means 30 which cools a solder attaching part 20a of the die 20 which attaches at least the solder 21. The cooling means 30 cools the solder attaching part 20a of the die 20 to a temperature where the solder 21 is not fused when heating the die 20 up to the fusing temperature of the solder 21 by the heater 6.
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