发明名称 |
LAMINATED FILM AND FILM CARRIER TAPE FOR PACKAGING ELECTRONIC COMPONENT |
摘要 |
PURPOSE: To provide a laminated film for packaging electronic components that can easily and effectively reduce the warpage in a widthwise direction of the laminated firm for packaging electronic components, and to provide a film carrier tape for packaging electronic components. CONSTITUTION: In a laminated film 10 where a conductor layer 11 and an insulating film 14 are subjected to thermocompression bonding, a coefficient of thermal expansion in the widthwise direction of the insulating film 14 is nearly the same as or larger than that in the widthwise direction of the conductor layer 11. |
申请公布号 |
KR20030016184(A) |
申请公布日期 |
2003.02.26 |
申请号 |
KR20020048894 |
申请日期 |
2002.08.19 |
申请人 |
MITSUI KINZOKU KOGYO KABUSHIKI KAISHA |
发明人 |
KAWASAKI SHUICHI;TERADA HIROMU |
分类号 |
H01L21/60;H01L23/498;H05K1/00;H05K1/03;H05K3/38;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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