发明名称 MOLDED TEMPERATURE SENSOR
摘要 PROBLEM TO BE SOLVED: To provide a molded temperature sensor that is formed by molding a thin-film resistance temperature detecting element 1 with a synthetic resin and that is rigid and has a stable characteristic enough to prevent such a defect that a thin film 3 is damaged or a lead wire is disconnected due to an external force such as bending or the like or the excessive tension of an extension lead wire. SOLUTION: A square flat plate 1 is fitted and held in a recessed part 7 pinched by a two-way leg part 7A of a supporting plate 6, a pair of lead wire connection conductors 9 are provided on a supporting plate base 8, an element lead wire 4 and an extension lead wire 12 are respectively soldered, and they are entirely molded M with a polyamide resin.
申请公布号 JP2003057122(A) 申请公布日期 2003.02.26
申请号 JP20010243611 申请日期 2001.08.10
申请人 HAYASHI DENKO KK 发明人 HAYASHI MASAKI
分类号 G01K7/18;H01C7/02;(IPC1-7):G01K7/18 主分类号 G01K7/18
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