MULTI ADHESIVE DISPENSING UNIT AND SEMICONDUCTOR CHIP BONDING UNIT

摘要

PURPOSE: A multi adhesive dispensing unit and a semiconductor chip bonding unit are provided to reduce a loss of time by performing simultaneously an adhesive on each position on semiconductor chips. CONSTITUTION: A plurality of nozzles(114) are arranged on a multi-nozzle head(112). The number of nozzles(114) corresponds to the number of semiconductor chips. A base block(110) has a predetermined size to be combined with the multi-nozzle head(112). An adhesive is provided to a space portion of the inside of the multi-nozzle head(112). A plurality of adhesive distribution projections(116) are formed on the inside of the multi-nozzle head(112) according positions of the nozzles(114). The adhesive distribution projections(116) are used for distributing uniformly the adhesive to the nozzles(114).