| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition suitable for packaging an electronic part, and further to prepare a sheet, or the like, using the composition. SOLUTION: This resin composition comprises a styrenic resin containing a rubber component and a styrene-conjugate diene block copolymer in the ratio of (20 pts.wt.: 80 pts.wt.) to (80 pts.wt.: 20 pts.wt.), and the styrenic resin containing the rubber satisfies one or more of the following items: 1: the graft rate is >=2.0; 2: the rubber content in the resin composition is <=1%; and 3: the diameter of the rubber particle is 2.0-3.0μm. The sheet, or the like, is obtained by using the composition.
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