发明名称 Thermally conductive sheet
摘要 <p>A thermally conductive sheet comprising boron nitride powder as a first thermally conductive filler dispersed into an organic matrix, wherein the boron nitride powder is hexagonal boron nitride (h-BN), and comprises primary particles and secondary aggregates formed by aggregation of the primary particles, wherein at least part of the secondary aggregates being 50 µm or more in size. The boron nitride powder preferably includes 1 to 20 percent by weight of secondary aggregates of 50 µm or more in size. The organic matrix material is preferably silicone rubber.</p>
申请公布号 EP1286394(A2) 申请公布日期 2003.02.26
申请号 EP20020292051 申请日期 2002.08.16
申请人 POLYMATECH CO., LTD. 发明人 ISHIHARA, NATSUKO
分类号 H01L23/36;H01L23/15;H01L23/373;(IPC1-7):H01L23/373 主分类号 H01L23/36
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