发明名称 HARDENABLE PRESSURE-SENSITIVE ADHESIVE TAPE
摘要 <p>PROBLEM TO BE SOLVED: To provide a hardenable pressure-sensitive adhesive tape having the hardenable pressure-sensitive adhesive layer which is capable of reducing the water absorption in the cured substance of the hardenable pressure-sensitive adhesive and capable of lowering the modulus at the time of heat pressure contact. SOLUTION: The hardenable pressure-sensitive adhesive tape, comprising a base material and a hardenable pressure-sensitive adhesive layer which is formed thereon and consists of (A) a pressure-sensitive adhesive component, (B) an epoxy resin, (C) a thermally active type of a latent epoxy resin hardener, (D) an energy radiation-polymerizable compound, and (E) a photopolymerization initiator, is characterized in that the either one or the both of the above epoxy resin (B) and the above energy radiation-polymerizable compound (D) have dicyclopentadiene nuclei in their molecules.</p>
申请公布号 JP2003055623(A) 申请公布日期 2003.02.26
申请号 JP20010250134 申请日期 2001.08.21
申请人 LINTEC CORP 发明人 SUMI TAKAJI;YAMAZAKI OSAMU;SUGINO TAKASHI;SENOO HIDEO
分类号 C08G59/24;C08G59/32;C08G59/40;C08K5/00;C08K5/103;C09J4/00;C09J7/02;C09J163/00;G03F7/038;H01L21/52;H01L21/68;(IPC1-7):C09J7/02 主分类号 C08G59/24
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