| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition for a flexible printed circuit board, having high flame retardancy and excellent in both reliability in flexing and adhesiveness. SOLUTION: The adhesive composition for a flexible printed circuit board contains 18-25 wt.% of an aromatic phosphoric ester, 5-25 wt.% of a flexibilizer, and a metal hydroxide represented by general formula (1): M1- XQX(OH)2 (wherein M stands for at least one kind of metal atom selected from the group consisting of Mg, Ca, Sn and Ti; Q stands for at least one kind of metal atom selected from the group consisting of Mn, Fe, Co, Ni, Cu and Zn; and X is a positive number of 0.01 to 0.5).
|
