发明名称 METHOD AND SYSTEM FOR TRANSFER OF SUBSTRATE, AND LOADING PORT APPARATUS
摘要 PURPOSE: To prevent the open air from creeping into a substrate housing container when the door of the substrate housing container is opened, and to restrain a foreign substance from adhering to a substrate housed at the inside of the substrate housing container. CONSTITUTION: In the wafer transfer method for the substrate, the substrate housing container in which the substrate is housed so as to be sealed with the door is placed on the loading port apparatus provided at a substrate treatment apparatus, the door of the loading port apparatus and the door of the substrate housing container are faced so as to be docked, the door of the substrate housing container is opened, and the substrate housed at the inside is transferred into the substrate treatment apparatus. Before the door is opened, the inside of the substrate housing container is pressurized.
申请公布号 KR20030016165(A) 申请公布日期 2003.02.26
申请号 KR20020045486 申请日期 2002.08.01
申请人 SEMICONDUCTOR LEADING EDGE TECHNOLOGIES, INC. 发明人 SEITA HISAHARU
分类号 B65G49/00;B65G49/06;B65G49/07;H01L21/673;H01L21/677;H01L21/68;(IPC1-7):H01L21/68 主分类号 B65G49/00
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