METHOD AND DEVICE FOR LASER BEAM MACHINING

摘要

PROBLEM TO BE SOLVED: To provide a method and a device for laser beam machining by which the damage of an inner layer is suppressed to the minimum and a smear is not made at the part to be machined when a hole which connects the surface and a target inner layer is machined on a work having a multilayer structure. SOLUTION: A radiated light radiated by the inner layer when machined is detected with a detector 10. A processing circuit 20 decides that the hole bottom reaches the target inner layer when the value of the output signal of the detector 10 reaches a prescribed value or greater. The processing circuit 20 drives a laser driver 21 for removing the smear, and the hole is additionally irradiated with the laser beam at prescribed times. In this case, it is effective when the energy of the additionally irradiated laser beam is set smaller.