发明名称 METHOD FOR ETCHING SUBSTRATE AND ETCHING DEVICE
摘要 PROBLEM TO BE SOLVED: To etch a flexible substrate in such a manner that the entire surface thereof receives an etching effect uniformly over the entire surface of the substrate by improving a technique of etching the flexible substrate by spraying an etchant to the flexible substrate 3 from a nozzle 7 while conveying the substrate 3. SOLUTION: The conveyance direction (arrow (d)) of a belt conveyor 9 is inclined with respect to the horizontal and the flexible substrate 3 is placed thereon and is conveyed. As a result, the flatness of the flexible substrate 3 is maintained. Further, the belt conveyor is inclined and therefore the etchant (arrow (e)) sprayed from the nozzle 7 flows in the downhill direction of the inclination and a liquid pool is not produced in about the half in the uphill direction. The uniform etching is performed by spraying the etchant to the area where there is no liquid pool.
申请公布号 JP2003055779(A) 申请公布日期 2003.02.26
申请号 JP20010245441 申请日期 2001.08.13
申请人 KAMERIA:KK 发明人 TSUBAKI YOSHISATO
分类号 C23F1/08;H05K3/06;(IPC1-7):C23F1/08 主分类号 C23F1/08
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