发明名称 METHOD FOR INJECTION MOLDING AND MOLD APPARATUS FOR INJECTION MOLDING
摘要 PROBLEM TO BE SOLVED: To solve a problem wherein when a resin is overflowed into a pocket connected with a cavity, it is difficult to smoothly remove the overflown resin. SOLUTION: In Figure (a), the overflown resin 55 is pushed out from a movable mold 18 by elevating action of a slide member 40. In Figure (b), the overflown resin 55 is fill out from the pocket 42 by stopping the first half body 24 and elevating the second half body 25. It is thereby possible to automatically clean the pocket and to improve production efficiency.
申请公布号 JP2003053799(A) 申请公布日期 2003.02.26
申请号 JP20010246904 申请日期 2001.08.16
申请人 NISSEI PLASTICS IND CO 发明人 NAKAZAWA MAKOTO
分类号 B29C45/34;B29C45/00;(IPC1-7):B29C45/34 主分类号 B29C45/34
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