LOAD CUP FOR MECHANICAL AND CHEMICAL POLISHING DEVICE, MECHANICAL AND CHEMICAL POLISHING DEVICE, AND TRANSFER METHOD FOR SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a load cup for a mechanical and chemical polishing device, a mechanical and chemical polishing device, and a transfer method for a substrate capable of securely transferring the substrate held on a polishing head to a substrate support member of the load cup. SOLUTION: This load cup 4 of a CMP device 1 has a pedestal 12 supporting a wafer W, and three substrate grip members 23 gripping the wafer W by pressing an edge of the wafer W are arranged on a side of the pedestal 12. Each substrate grip member 23 has two protruding parts 26 for pressing protruding inward, and a claw part 27 for catching and holding the wafer W is provided on a pressing face of the protruding part 26 for pressing. A tapered face 27a inclined downward is formed in the claw part 27. Each substrate grip member 23 is connected to an L-shaped arm 28, which is turned by an air cylinder 30 to open and close each substrate grip member 23.