LASER MACHINING OF MATERIALS

摘要

The laser cutting device has laser device (1) providing a set of ultra short laser pulses with a duration of less than 300 picoseconds and a repetition rate of between 100 kHz and 1 GHz, converted into a second set of ultra short laser pulses with a duration of less than 300 picoseconds and a repetition rate of between 1 Hz and 1 MHz, before application to the material (4) to be cut, with detection of the first pulse of the second set for application to the material and detection of the obtained result. An independent claim for a laser cutting method using ultra short laser pulses is also included.