| 发明名称 |
Method for manufacturing copper-resin composite material |
| 摘要 |
<p>A method for forming copper-resin composite materials is disclosed. This method affixes a palladium or palladium-tin catalyst onto resin substrate, and then subjects the catalyst-containing resin to an electroless copper plating bath without performing a catalyst acceleration treatment step.</p> |
| 申请公布号 |
EP1286576(A2) |
申请公布日期 |
2003.02.26 |
| 申请号 |
EP20020255812 |
申请日期 |
2002.08.21 |
| 申请人 |
SHIPLEY COMPANY LLC |
发明人 |
SEITA, MASARU;TSUCHIDA, HIDEKI;IMANARI, MASAAKI;SUGITA, YOSHIHIRO |
| 分类号 |
C23C18/30;C23C18/28;C23C18/40;C25D7/00;H05K3/18;H05K3/38;(IPC1-7):H05K3/18;C23C18/20 |
主分类号 |
C23C18/30 |
| 代理机构 |
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