SUBSTRATE TREATMENT APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus capable of stabilizing both of the discharge pressure at the time of the discharge of a treatment liquid to a substrate from a discharge nozzle and the total discharge amount of the treatment liquid in a constant time if necessary. SOLUTION: A liquid pressure sensor 30 for detecting the liquid feed pressure of a resist is interposed between the electromotive pump 26 driven by a motor 24 and the discharge nozzle 18 provided on the way of the liquid feed piping 22 for connecting the discharge nozzle 18 for discharging the resist to a wafer W and a liquid sump part 20 and a control means for controlling the state of the coating film formed on the surface of the wafer W on the basis of the pressure detected by the liquid pressure sensor is provided.